Mechanic BGA IC Adhesive Removing Liquid

Mechanic BGA IC Adhesive Removing Liquid

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Mechanic BGA IC Adhesive Removing Liquid (Mechanic QC-20)

Highlights:
  • 20ml BGA IC glue epoxy remover.
  • Can help you soften & remove resinating/sealing glue of chip BGA IC of mobile phones easily.
  • Can quickly soften and loosen solidified resin adhesive such as epoxy, phenolics, acrylate, polyurethane, organosilicon, etc.
  • It won’t do harm to your circuit board and components.
  • Environment friendly and safe. Doesn’t contain any Benzene Coderivative substances with cause leukemia.
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