- RMA-223 Is a Moderately Active Rosin-Type Solder Paste , Which Is Widely Used In The SMD Rework Process Of Mobile Phone Boards
- For The No-Clean Solder Paste , The Color Of Residue Is Very Light And Has Very High SIR Value, It Is Recommended For BGA , CSP And Other Ball Array Solder Joint Rework And Ball Replacement
- Welding Fluxes, Cheap Welding Fluxes, 100g RMA 223 UV BGA PCB Flux Paste No Clean Solder / SMD Soldering Paste Flux Grease Flux Rma 223 For PCB Rework Reballing
- All pictures shown are for illustration purpose only.Actual product may vary due to product Enhancement
- CATEGORY TYPE:Welding & Soldering Supplies
- 100% new brand and high quality.
- Good immersion and high intensity joint.
- Easy to peel off with hands or tweezers, leave no residue.
- Won’t oxidating gold, copper, phosphorus, bronze, oxidation.
- High soaking ，high strength joints.
- No-toxic, no-corrosive, strong ability of insulation.
- Good insulation and smooth welding surface.
- No deterioration no dry.
- No poison no orrosion, no damage to parts.
1. Small smoke and light taste
2. Easy to clean, zero resistance
3. Excellent paste fluidity and strong welding ability
4. Pure and transparent solder paste liquid
- Can make the resistance in the welding process auxiliary accurate return, professional solution QFN / BGA hollow bubble, dense foot IC residue and so on.
- In the welding, can make the parent metal surface oxide reduction, effectively eliminate the oxide film
Imported rosin ,no virtual welding, easy to tin.
The color is pure, no impurities.
Running tin is fast and has less smoke.
High insulation resistance, suitable for mobile phone PCB,CPU repair.
- Designed for soldering and reballing BGA, PGA and SMD components on phone mainboards.
- Lead free and no residue.
- Features high viscosity and high activity.
- Provides quick and high-quality tinning with a minimum amount of smoke.