- 20ml BGA IC glue epoxy remover.
- Can help you soften & remove resinating/sealing glue of chip BGA IC of mobile phones easily.
- Can quickly soften and loosen solidified resin adhesive such as epoxy, phenolics, acrylate, polyurethane, organosilicon, etc.
- It won’t do harm to your circuit board and components.
- Environment friendly and safe. Doesn’t contain any Benzene Coderivative substances with cause leukemia.
- Convenient to use
Shipping & Handling-
If Your placing a Order Your order will be in Process Immediately & on Same Day You will get
Tracking order on your whats-app or on your Email at Evening 7.00 pm to 9.00 pm
In City & Town Area it will Take approx 5 to 6 days, Village or Rural Area it will take approx 7 to 8 days
Note – If you want enquirer about Delivery you can Whats App Us On This Number – 9967040744