Model : Supported Ic’s
MT6755-6750V-R9-A37-Y67
₹270.00 ₹300.00
Model : Supported Ic’s
MT6755-6750V-R9-A37-Y67
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Blank Dongle for UMT , UMT Pro ,CM2 , EFT Dongle , and Many More Dongle
Features:
BGA-IC Adhesive Remove Liquid, High-effect
For the mobile phone BGA/IC Resin sealant
Softened and removed, Scientific formula
Does not hurt the Motherboard or Component
RL-039 can quickly soften Resin
UFI Dongle is security dongle to be used with UFI Android ToolBox, No additional activation is needed.
Ultra low cost, Rich features, Using the same software used by UFIBOX.
• Debrick Android Intel devices(ASUS, Lenovo, etc)
• Debrick Android Qualcomm (HSUSB 9008) devices
• Repair Imei for Android Intel and Qualcomm (and another platform in future update)
• Normal flashing via Fastboot, Intel and Qualcomm Sahara or Firehose protocol
• Support files for Firmware
10-20 Mins DELIVERY TIME
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