RELIFE RL-223-OR Solder Paste 100g

600.00

20% Off
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Price Summary
  • 750.00
  • 600.00
  • 20%
  • 600.00
  • Overall you save 150.00 (20%) on this product
In Stock
Highlights:
  • Designed for soldering and reballing BGA, PGA and SMD components on phone mainboards.
  • Lead free and no residue.
  • Features high viscosity and high activity.
  • Provides quick and high-quality tinning with a minimum amount of smoke.
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Description
  • Designed for soldering and reballing BGA, PGA and SMD components on phone mainboards.
  • Lead free and no residue.
  • Features high viscosity and high activity.
  • Provides quick and high-quality tinning with a minimum amount of smoke.
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Shipping & Handling-
If Your placing a Order Your order will be in Process Immediately & on Same Day You will get

Tracking order on your whats-app or on your Email at Evening 7.00 pm to 9.00 pm

Delivery Time
In City & Town Area it will Take approx 5 to 6 days, Village or Rural Area it will take approx 7 to 8 days

Note – If you want enquirer about Delivery you can Whats App Us On This Number – 9967040744

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