Model : Supported Ic’s
EXYNOS -7420 CPU-S6/S6+/NOTE5–G9200-9250-N9200
₹270.00 ₹300.00
Model : Supported Ic’s
EXYNOS -7420 CPU-S6/S6+/NOTE5–G9200-9250-N9200
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1. Imported rosin from Japan, environmentally , lead-free and halogen-free, with high safety.
2. Strong activity, good viscosity, good fluidity and easier tinning.
3. Milky white paste, no residue, fast tinning.
4. High insulation resistance, suitable for mobile phone motherboards, cpu repair, etc.
CE – ROHS – FCC – ISO 9001-2008
Power interface:USB port
Input voltage:220V
Power:30W
Temperature range:250-450℃
Heating element:Ceramic heating
Core length:1.5M
With leg safety light, ergonomic hand light, abti slip silicone sleeve, comfortable
Special Combo offer
Package includes:
1 x UMT Dongle + 1 x Mobile Software Course Vol- 1
BGA-IC Adhesive Remove Liquid, High-effect
For the mobile phone BGA/IC Resin sealant
Softened and removed, Scientific formula
Does not hurt the Motherboard or Component
RL-039 can quickly soften Resin
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