Model : Supported Ic’s
665-SM6125-710-SDM710 —- A3
₹270.00 ₹300.00
Model : Supported Ic’s
665-SM6125-710-SDM710 —- A3
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TFM Tool Pro Activation (2 YEAR)
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BGA-IC Adhesive Remove Liquid, High-effect
For the mobile phone BGA/IC Resin sealant
Softened and removed, Scientific formula
Does not hurt the Motherboard or Component
RL-039 can quickly soften Resin
Special Combo offer
Package includes:
1 x UMT+Nck Pro Dongle + 1 x Mobile Software Course Vol- 1
Infinity – Box / Dongle 1 Year Updates / Support Renew, Chinese Miracle -2
————————————————————————————————————Price / Log — Delivery Time 10-20 Mins Instant
NOTE: You wont lose your license if you format your computer because HW-Tool login with username and password”
Features:
- Support Huawei Hisi all the CPU(970 980 990 659…)
- Support Huawei Qualcomm CPU
- Support Huawei MTK CPU
- All the EMUI system (EMUI 9.1 9.0 10.0) FRP and Huawei id
- Support Huawei flash (repair with hand on the logo, system damage, dead phone make alive)
- Working with Huawei phone flash & bypass FRP and Huawei id
- Support EMUI10 system and this time
- Support Huawei phone 9.1 9.0 8.2 8.0 downgrade
- Support Huawei phone even last Mate30 Mate30 Pro Mate 20 5G P30 P30PRO V20…working on it
- A powerful for Huawei Phones
Unlock Credits Pricing & Unlock Credits:
Promo period:
– From 1.07.2017 till 31.07.2017 – 1 success code reading will take 5 credits.
– From 31.07.2017 – 1 success code reading will take 10 credits.
Price for 50 credits = 70usd.
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